Is ASML really the bottleneck? Do you believe anybody but TSMC and few fabs could really use and acquire those machines? I don't know the throughput of a EUV device from ASML but I imagine you need :
- clean room, itself needing the infrastructure for it (size, airCo, filtering, electricity) and the staff to run and maintain that basically empty space
- wafers to "print" on, so that's a lot of water and logistic to manipulate them (so infrastructure for clean water and all chemicals) also with dedicated staff
- finally staff who would be able to design something significantly better than NVIDIA, Intel, Broadcom, IBM, etc while (and arguably that's the trickiest part IMHO) being able to get it good enough as at a scale that can be manufactured from their own fab.
so I'm wondering who can afford this kind of setup that can only then make use of ASML machines.
> (so infrastructure for clean water and all chemicals)
Fabs are some of the most complex chemical engineering sites (dealing with some of the most dangerous substances) in the world. So don't underestimate the complexity of this part.
- clean room, itself needing the infrastructure for it (size, airCo, filtering, electricity) and the staff to run and maintain that basically empty space - wafers to "print" on, so that's a lot of water and logistic to manipulate them (so infrastructure for clean water and all chemicals) also with dedicated staff - finally staff who would be able to design something significantly better than NVIDIA, Intel, Broadcom, IBM, etc while (and arguably that's the trickiest part IMHO) being able to get it good enough as at a scale that can be manufactured from their own fab.
so I'm wondering who can afford this kind of setup that can only then make use of ASML machines.